JPH0342704B2 - - Google Patents
Info
- Publication number
- JPH0342704B2 JPH0342704B2 JP62047407A JP4740787A JPH0342704B2 JP H0342704 B2 JPH0342704 B2 JP H0342704B2 JP 62047407 A JP62047407 A JP 62047407A JP 4740787 A JP4740787 A JP 4740787A JP H0342704 B2 JPH0342704 B2 JP H0342704B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature side
- low
- heat sink
- thermoelectric
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62047407A JPS63213981A (ja) | 1987-03-02 | 1987-03-02 | 熱電装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62047407A JPS63213981A (ja) | 1987-03-02 | 1987-03-02 | 熱電装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63213981A JPS63213981A (ja) | 1988-09-06 |
JPH0342704B2 true JPH0342704B2 (en]) | 1991-06-28 |
Family
ID=12774267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62047407A Granted JPS63213981A (ja) | 1987-03-02 | 1987-03-02 | 熱電装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63213981A (en]) |
-
1987
- 1987-03-02 JP JP62047407A patent/JPS63213981A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS63213981A (ja) | 1988-09-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR19990066931A (ko) | 열전기 모듈의 제조 및 이것에 사용되는 땜납 | |
TWI299581B (en) | Thermoelectric device and method of manufacturing the same | |
JP2001168368A (ja) | 端子ボックス | |
JP5671569B2 (ja) | 熱電変換モジュール | |
JP2001267642A (ja) | 熱電変換モジュールの製造方法 | |
JP7617519B2 (ja) | 熱電変換モジュール | |
KR20210138004A (ko) | 열전 변환 모듈 | |
JP2006073632A (ja) | 熱電変換装置および熱電変換装置の製造方法 | |
JP2008177356A (ja) | 熱電発電素子 | |
JP2018093152A (ja) | 熱発電デバイス | |
JPH0793459B2 (ja) | 熱電装置 | |
JPH0333082Y2 (en]) | ||
JPH0333083Y2 (en]) | ||
JPH0342704B2 (en]) | ||
KR102323978B1 (ko) | 열전 모듈 | |
JP4719861B2 (ja) | 熱電素子および熱電発電モジュール | |
JPH1022531A (ja) | 熱電変換素子 | |
JPH0485973A (ja) | 熱電発電装置 | |
JP3588355B2 (ja) | 熱電変換モジュール用基板及び熱電変換モジュール | |
US5034044A (en) | Method of bonding a silicon package for a power semiconductor device | |
US5133795A (en) | Method of making a silicon package for a power semiconductor device | |
JPH08293628A (ja) | 熱電気変換装置 | |
JP2598257B2 (ja) | 熱電発電装置 | |
JP2002076448A (ja) | 熱電素子 | |
JP3173086B2 (ja) | 可溶合金型温度ヒューズ |